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S101D01/S101D02/S201D01/S201D02
S101D01/S101D02 S201D01/S201D02
s Features
1. Compact ( 16-pin dual-in-line package type) 2. RMS ON-state current I T : 1.2Arms 3. Built-in zero-cross circuit ( S101D02 , S201D02 ) 4. Recognised by UL, file No. E94758 5. Approved by CSA, No. LR63705
16-Pin DIP Type SSR for Low Power Control
s Outline Dimensions
Internal connection diagram
16 15 13 11
( Unit : mm )
g Zero-cross circuit
9
2
3
4
5
6
7 *To radiate the heat, solder the lead pins 4 to 7 , 9 on the pattern of the PWB without using a socket such that there is no open pin left.
s Applications
1. Fan heaters 2. Microwave ovens 3. Refrigerators 4. Air conditioners
2 Anode 3 Cathode 11 T 1 9 , 13 T 2 15 Gate 16 NC
16 15 13
11
9 A ( Model No. ) S101D01 S101D02 S201D01 S201D02 7.62 0.3 0.5TYP. 3.5 0.5 3.4 0.5 0.5 0.1 0.26 0.1 : 0 to 13 6.5 0.5
A
s Model Line-ups
For 100V lines For phase control No built-in zerocross circuit Built-in zerocross circuit S101D01 S101D02 For 200V lines S201D01 S201D02
Anode mark
2
3 4 5 2.54 0.25 19.82
0.5
6
7 1.2 0.2
g Zero-cross circuit for
S101D02 /S201D02
s Absolute Maximum Ratings
Parameter Input Forward current Reverse voltage RMS ON-state current *1 Peak one cycle surge current Repetitive peak OFF-state voltage *2 Isolation voltage Operating temperature Storage temperature *3 Soldering temperature Symbol IF VR IT I surge V DRM V iso T opr T stg T sol 400 4 000 - 25 to + 85 - 40 to + 125 260 Rating S101D01/S101D02 50 6 1.2 12 600
( Ta = 25C )
S201D01/S201D02 Unit mA V A rms A V V rms C C C
Output
*1 50Hz, sine wave *2 40 to 60% RH, AC 60Hz for 1 minute *3 For 10 seconds
" In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device."
S101D01/S101D02/S201D01/S201D02 s Electrical Characteristics
Input Parameter Forward voltage Reverse current Repetitive S101D01 / S101D02 peak OFF-state S201D01 / S201D02 current ON-state voltage Holding current Zero-cross voltage S101D02 / S201D02 Critical rate of S101D01 / S101D02 rise of OFF-state S201D01 / S201D02 voltage Minimum trigger current Isolation resistance Turn-on time Symbol VF IR I DRM VT IH V OX dV/dt I FT R ISO t on Conditions IF = 20mA VR = 3V VDRM = 400V VDRM = 600V IT = 1.2A VD = 6V Resistance load, I F = 15mA VDRM = 1/ 2 * 400V VDRM = 1/ 2 * 600V VD = 6V, R L = 100 DC500V, 40 to 60% RH VD = 6V, RL = 100 , IF = 20mA MIN. 200 100 5 x 1010 TYP. 1.2 1011 -
( Ta = 25C )
MAX. 1.4 10 - 5 10 - 4 10 - 4 1.7 25 35 10 100 Unit V A A A V mA V V/ s V/ s mA s
Output
Transfer characteristics
Fig. 1 RMS ON-state Current vs. Ambient Temperature
1.6 1.4 RMS ON-state current IT ( Arms )
Fig. 2 Forward Current vs. Ambient Temperature
80 70 Forward current I F ( mA ) 60 50 40 30 20 10 0 - 25
1.2 1.0 0.8 0.6 0.4 0.2 0 - 25
0
40 50 25 75 85 Ambient temperature T a ( C )
100
0
25 50 55 75 85 Ambient temperature T a ( C )
100
Fig. 3 Forward Current vs. Forward Voltage
50C 25C 0C 200 100
Ta = 75C
Fig. 4 Minimum Trigger Current vs. Ambient Temperature ( S101D01)
12 Minimum trigger current I FT ( mA ) VD = 6V RL = 100 10
Forward current I F ( mA )
50
- 25C
8
20 10 5
6
4
2 1 0
2
0.5
1.0 1.5 2.0 Forward voltage V F ( V )
2.5
3.0
0 - 30
0 20 40 60 80 Ambient temperature Ta ( C )
100
S101D01/S101D02/S201D01/S201D02
Fig. 5 Minimum Trigger Current vs. Ambient Temperature (S101D02 , S201D02 )
12 VD = 6V RL= 100 Minimum trigger current I FT ( mA ) Minimum trigger current I FT ( mA ) 10 10
Fig. 6 Minimum Trigger Current vs. Ambient Temperature (S201D01 )
12 VD = 6V RL= 100
8
8
6
6
4
4
2
2
0 - 30
0 20 40 60 80 Ambient temperature T a ( C )
100
0 - 30
0 20 40 60 80 Ambient temperature T a ( C )
100
Fig. 7 ON-state Voltage vs. Ambient Temperature
1.4 I T = 1.2A 1.3 ON-state voltage VT ( V )
Fig. 8 Relative Holding Current vs. Ambient Temperature
Relative holding current IH (tC) /I H ( 25C ) x 100(% ) V D = 6V 103
1.2
1.1
102
1.0
0.9
0.8 - 30
0 20 40 60 80 Ambient temperature T a ( C )
100
101 - 30
0 20 40 60 80 Ambient temperature T a ( C )
100
Fig. 9 ON-state Current vs. ON-state Voltage
1.2 I F = 20mA T a = 25C 1.0
Fig.10 Turn-on Time vs. Forward Current (S101D01 )
100 90 80 70 60 Turn-on time t on ( s ) 50 40 30 VD = 6V RL= 100 T a = 25C
ON-state current I T ( A )
0.8
0.6
0.4
20
0.2
0 0
0.5 1.0 ON-state voltage V T ( V )
1.5
10 10
20 30 40 50 Forward current I F ( mA )
100
S101D01/S101D02/S201D01/S201D02
Fig.11 Turn-on Time vs. Forward Current (S101D02 , S201D02 )
100 VD = 6V RL= 100 T a = 25C Turn-on time t on ( s ) Turn-on time t on ( s ) 50 40 30 100
Fig.12 Turn-on Time vs. Forward Current (S201D01)
200 VD = 6V RL= 100 T a = 25C
50 40 30
20
10 10
20 30 40 50 Forward current I F ( mA )
100
20 10
20 30 40 50 Forward current I F ( mA )
100
s Basic Operation Circuit
R1 + VCC D1 3 V1 Tr1 ZS : Surge absorption circuit 2 SSR 11 13 ZS Load AC 100V (S101D01 / S101D02 ) AC 200V (S201D01 / S201D02 )
( 1 ) DC Drive AC supply voltage Input signal Load current ( for resistance load)
( 2 ) Pulse Drive
( 3 ) Phase Control
9
Notes 1 ) If large amount of surge is loaded onto V CC or the driver circuit, add a diode D 1 between terminals 2 and 3 to prevent reverse bias from being applied to the infrared LED. 2 ) Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be carefully done especially for an inductive load. 3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be more than 60mA. ( Precautions for Use ) 1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins ) . In designing, take into the heat radiation from the mounted SSR. 2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin 13 when designing mounting pattern. The rounded part of Pin 15 ( gate ) must be as small as possible. Pulling the gate pattern around increases the change of being affected by external noise. 3 ) As for other general cautions, refer to the chapter " Precautions for Use "

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